Sponsored by Heraeus Electronics
In recent times, the demand for prime powered electronics has grown exponentially. With fast progress in electrical/hybrid autos, we’re seeing that extra electronics and energy modules are wanted to maintain up with demand. Nevertheless, EV/Hybrid autos should not the one purposes driving this elevated demand. Different main purposes, similar to rail traction, wind generators, photovoltaic inverters and motor drives are additionally driving the elevated demand. These purposes are extraordinarily demanding and are working at excessive voltage and excessive present densities that should deal with excessive temperatures and harsh situations. One of many key elements for a extremely dependable energy module is an especially dependable steel ceramic substrate. Substrate supplies for these purposes should have excellent traits by way of electrical, thermal, insulation, and mechanical efficiency throughout operation. To have a dependable system in place it is advisable to have a suitable interconnection and meeting supplies like solder paste, sinter paste, and wire bonding, to call just a few.
Resulting from price effectivity, Al2O3 based mostly steel ceramic substrates, like direct copper bonded substrates are sometimes used for energy module manufacturing. Though, it’s a cheaper resolution, it isn’t all the time the very best for sure purposes, particularly for prime energy modules. Al2O3 based mostly ceramic substrates battle to harness the total energy of huge band hole semiconductors. On this occasion, a superior substrate is required. Silicon nitride (Si3N4) based mostly steel ceramic substrates have been used in recent times for energy module meeting. Its superior mechanical properties, similar to bending power, fracture toughness and thermal conductivity makes Si3N4 a sexy resolution for a extremely dependable, excessive energy density module base. At present Si3N4 substrates are manufactured utilizing lively steel brazing (AMB) expertise, which makes use of Ag-filled and titanium containing brazing pastes. Valuable steel and complicated processing steps drive the costs up for AMB substrates making it a dearer possibility.
Heraeus Electronics has developed an answer that solves the associated fee and efficiency roadblocks beforehand described. It’s a price environment friendly, extremely dependable Ag-free AMB copper bonding expertise for becoming a member of nitride-based ceramics with copper foils. The fabric was developed utilizing a method the place there isn’t any requirement for utilizing costly vacuum-based brazing and longer course of time. The product is called: Condura®.extremely, a Si3N4 Ag free AMB substrate.
- Excellent reliability and processing (eg. Sintering, bonding, soldering…)
- Price environment friendly Si3N4 steel ceramic substrate
- Permits thick Cu layers
- Thinner ceramics vs. AIN potential for equal thermal
- Thermal conductivity of Si3N4 ceramic:
- > 80 W/m∙Okay
- > 60 W/m∙Okay
Condura®.extremely is a cost-efficient Ag free AMB bonding expertise for steel ceramic substrates which are appropriate for prime finish purposes. The associated fee discount of Condura®.extremely is achieved through the use of a silver-free brazing expertise mixed with an environment friendly brazing course of.
Under in Determine 1, it provides a take a look at the thermal shock efficiency of Condura®.extremely.
SAM footage of 20 particular person Condura®.extremely take a look at layouts earlier than and after thermal shock exams (liquid to liquid -65 ° C to + 150 ° C). No main degradation is seen after 8000 cycles. The purple shade signifies the etched isolation groove which is a part of the take a look at structure. Within the occasion of delamination between copper and brazed steel as a result of thermal shock, the purple shade groove would broaden. This exhibits that Condura®.extremely qualifies to totally leverage the mechanical robustness of the Si3N4 ceramics in an analogous method because the Ag containing AMB expertise.
Heraeus Electronics reveals at PCIM Europe 10-12th Could
Condura®.extremely will launch globally this 12 months at PCIM Europe. PCIM Europe is the main convention and exhibition for energy electronics, renewable power, and power administration, going down in Nuremberg from Could 10-12, 2022. Whereas on the present go to Heraeus Electronics in Corridor 6, Sales space 322 to talk with our crew about Condura®.extremely or a few of our different new options for interconnects and die connect.
Be part of Heraeus Electronics Stay on the e-mobility discussion board
On Tuesday Could 10th at 11:20am CEST Heraeus Electronics will supply a sneak peak at our mAgic® Copper Sinter Paste with a presentation titled “ How close to is copper sintering”. For extra data, please go to us on the present or attain out to your native account supervisor.
On Wednesday Could 11th at 12:50pm CEST Heraeus Electronics current on the Condura® product household and the way Heraeus Electronics will meet rising buyer expectations on the reliability, thermal efficiency, lifetime and worth of steel ceramic substrates. Additionally on this presentation a brand new addition to the Condura® product line shall be unveiled.